Difference between revisions of "Instrument Backplane"
(Created page with '{{Hierarchy header}} The Instrument backplane (IB) circuit distributes the cryostat signals on the 3 or 5 MDM connectors to the circuit boards in the chassis. There are series lo…') |
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Revision as of 18:17, 24 January 2012
Template:Hierarchy header The Instrument backplane (IB) circuit distributes the cryostat signals on the 3 or 5 MDM connectors to the circuit boards in the chassis. There are series load resistors for sq1_bias, ssa_fb, sq2_bias, sq2_fb, sq1_fb on the IB card.
There are two different types of IB cards to support 3-MDM or 5-MDM MCE crates.
The 5-MDM circuit board contains nine 96 pin 2mm connectors. Only eight connectors are used as the Clock Card connector has no analog signals. The backplane has 5 gold dot areas for mating to Delphi gold dot flex circuits (MCEv1) or 5 Hirose connectors (MCEv2). The 5 flex sections or Hirose connectors go to 5 pcb-mounted 100 pin MDM connectors.
Some spare signals are connected between the MDM connectors and the Instrument Backplane. These terminate at surface mount pads on the backplane.
Schematics
- MCEv2 3-MDM C1 (C587-101) [PDF] (Configurable jumpers route BC3 DAC00 to DAC15 to TES 00 to 15)
- MCEv2 3-MDM C2 (C587-101) [PDF] (Configurable jumpers route BC2 DAC16 to DAC31 to TES 00 to 15)
- MCEv2 3-MDM B (C587-101) [PDF] (BC3 DAC00 to DAC15 are routed to TES 00 to 15, not configurable)
- MCEv2 5-MDM A0 (C587-201) [PDF] (one detector bias per column)
- MCEv1 5-MDM C3 (S587-101) [PDF] (1 detector bias, 1 pixel heater, Rs1fb=2.0k)
- MCEv1 5-MDM C5 (S587-101) [PDF] (3 detector bias, Rs1fb=6.8k)
